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Buhnen HB 4100 Gear Pump

Buhnen HB 4100 Gear Pump
Buhnen HB 4100 Gear Pump

Buhnen HB 4100 Gear Pump Specification

  • Melting Tank Capacity
  • Approx. 4 litres
  • Model
  • HB 4100
  • Dispensing Rate
  • Up to 10 kg/h (material dependent)
  • Safety Features
  • Overheat and dry-run protection
  • Controller
  • Digital temperature control
  • Material Compatibility
  • EVA, Polyamide, Polyurethane, PSA hotmelts
  • Application
  • Hotmelt adhesive dispensing
  • Pump Type
  • Precision gear pump
  • Type
  • Gear Pump
  • Number of Hoses
  • Up to 2 hoses connectable
  • Color
  • Blue & White
 
 

About Buhnen HB 4100 Gear Pump

Specifications

Brand

Buhnen

Model Name/Number

HB4100

Phase

Three Phase

Warranty

1 year

Dimensions

700 x 395 x 420 mm

Voltage

400 V

Noise Emission Level

60 dBA

Weight

50 Kg

Approx,Melting capcity

12 / Kg/H

Delivery Rate Of Gear Pump

40 kg/hour

Tank Capacity

9 Litres

Particularly Designed for

EVA

 



Reliable Precision for Industrial Adhesive Application

The HB 4100 Gear Pump delivers consistent adhesive flows thanks to its precision engineering and robust gear pump mechanism. Tailored for industries requiring accuracy and repeatability, this system streamlines hotmelt adhesive processes, reducing waste and ensuring strong, durable bonds. Digital temperature controls further guarantee optimal adhesive viscosity and prevent operational mishaps.


Versatile Compatibility and Flexible Usage

Designed to work seamlessly with a range of adhesives-such as EVA, polyamide, polyurethane, and PSA hotmelts-the HB 4100 supports a wide variety of application requirements. Its adaptable setup, allowing up to two hoses, makes it suitable for dynamic production lines where flexibility and efficiency are critical. Compact and easily integrated, it's a practical addition to industrial workflows.

FAQ's of Buhnen HB 4100 Gear Pump:


Q: How do I operate the Buhnen HB 4100 Gear Pump for hotmelt adhesive dispensing?

A: To operate the HB 4100, fill the melting tank with compatible hotmelt adhesive, set the desired temperature using the digital controller, and connect up to two hoses. Once the adhesive is melted and the system has reached the set temperature, activate the precision gear pump for controlled dispensing.

Q: What types of materials are compatible with the HB 4100 Gear Pump?

A: The HB 4100 is suitable for dispensing various hotmelt adhesives, including EVA, polyamide, polyurethane, and PSA hotmelts. It offers reliable performance with these materials, ensuring strong bonding across different industrial applications.

Q: When should I perform maintenance on the HB 4100 Gear Pump?

A: Routine maintenance should be performed in accordance with your usage frequency and manufacturer guidelines. It is advisable to clean the melting tank after every adhesive change and inspect the hoses and pump regularly to prevent blockages or adhesive buildup.

Q: Where can the Buhnen HB 4100 Gear Pump be installed in my facility?

A: This gear pump is compact and versatile, making it suitable for installation in various industrial environments-near assembly lines, packaging stations, or other sites requiring hotmelt adhesive dispensing. Ensure placement on a stable, accessible surface with proper ventilation.

Q: What is the dispensing capacity of the HB 4100 model?

A: The HB 4100 can dispense up to 10 kg of adhesive per hour, depending on the type of material used. This high dispensing rate allows efficient handling of both small and large-scale adhesive applications.

Q: How do the safety features protect the operator and equipment?

A: The system includes overheat and dry-run protection, which automatically deactivates the heater if temperatures exceed safe limits or if adhesive runs out. These features help prevent equipment damage and ensure operator safety during operation.

Q: What benefits does the digital temperature control offer for adhesive applications?

A: Digital temperature control allows for precise regulation of adhesive temperature, ensuring consistent viscosity and optimal bonding performance. This enhances application quality and reduces the likelihood of production errors.

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